JISSO PROTEC 2024 - International Exhibition of State-of-the-Art Technologies of Electronic Component Mounting

JISSO PROTEC (Packaging Process Technology Exhibition) is a comprehensive exhibition of electronic component mounting technology. Electronic component mounting is an indispensable technology for manufacturing electronic devices and automobiles. We will evolve with the growth of the market and contribute to cutting-edge manufacturing, such as 5G-compatible smartphones and electric vehicles. JISSO PROTEC will be held simultaneously with 9 other exhibitions including the JPCA show under the collective name ``Electronic Equipment Total Solution Exhibition''. JISSO PROTEC (Packaging Process Technology Exhibition) ■Electronic component mounting machines and related equipment/systems: Electronic component mounting machines (mounters), electronic component insertion machines (inserters), cream solder printing machines, soldering equipment (reflow ovens), dispensers ■Mounting-related equipment/systems: Transport systems , AGV, automatic warehouse, taping machines/materials, bulk feeders/other feeders, automatic assembly equipment, laser marking equipment, cleaning equipment/cleaning agents ■Semiconductor mounting machines/systems: bonding equipment, flip chip mounting systems, COB systems ■Industrial use Robots: Handling robots, assembly robots, transfer robots, AMR ■Inspection/testing equipment: Board appearance inspection equipment, semiconductor manufacturing related inspection/measuring equipment ■Packaging design system: Design tools, production optimization software, packaging programming equipment ■Packaging devices/components and Related materials ■ Packaging materials for mounted devices ■ Mounting bonding systems/solder/bonding materials ■ High frequency compatible equipment/parts/materials ■ Environment-related equipment/materials Admission fee 1,000 yen (tax included) *Free for web registrants Co-hosted project PROTEC seminar, special seminar Sponsored by Japan Robot Association (JARA) Telephone: (03)3434-2919 FAX: (03)3578-1404 E-mail: [email protected] https://www.jara.jp/ Headquarters secretariat Japan Electronics Circuits Association (JPCA) Management office JTB Communication Design Co., Ltd. Celestine Shiba Mitsui Building, 3-23-1 Shiba, Minato-ku, Tokyo 105-8335 TEL: 03-5657-0767 FAX: 03-5657-0645 Held simultaneously ●JPCA Show 2024 Sponsor: Japan Electronics Circuits Association JPCA Show ●Microelectronics show sponsored by: Electronics Packaging Society microelectronics show ●Metaverse Device Exhibition Co-sponsored by: Japan Electronics Circuits Industry Association / Electronic Device Industry Newspaper (Sangyo Times) ●WIRE Japan Show co-sponsor: Japan Electronics Circuits Association / Electric Wire Newspaper (Industrial News) WIRE Japan Show ●Smart Sensing Co-sponsored by: Japan Electronics Circuits Association / JTB Communication Design Smart Sensing ●Electronics Component & Unit Show Co-sponsors: Japan Electronics Circuits Association / National Electronics Components Distribution Federation / Tokyo Electronics Wholesale Commercial Association ●E-Textile/Wearable Co-sponsored by: Japan Electronics Circuits Association / Senken Shimbunsha ●Unmanned Solution Exhibition Co-sponsored by: Japan Electronics Circuits Association / JTB Communication Design ●Edge Computing Co-sponsored by: Japan Electronics Circuits Association / JTB Communication Design

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